Solder Wick CP-2530 No-Clean Desoldering Wick (2.5mm × 3m)

Features

• High-quality woven copper desoldering braid for effective solder removal.
• Pre-fluxed with no-clean flux to improve solder absorption and wetting.
• 3.0 mm wide braid suitable for general PCB rework applications.
• Quickly removes excess solder from PCB pads, joints, and component leads.
• Helps repair solder bridges and incorrect solder connections.
• Low residue flux reduces the need for post-cleaning.
• Suitable for both through-hole and surface-mount component rework.
• Provides controlled solder removal when used with a soldering iron.
• Flexible copper braid conforms easily to different PCB areas.
• Compact spool design for convenient storage and workshop usage.
• Suitable for hobbyists, repair technicians, and professional electronics engineers.

Principle of Operation

The CP-2530 desoldering wick operates using capillary action. When the braid is placed over unwanted solder and heated with a soldering iron, the solder melts and is absorbed into the woven copper strands.

The integrated no-clean flux improves solder flow and bonding between the molten solder and copper braid, allowing efficient removal without excessive force. After the solder is absorbed, the used section of the wick is cut away and a fresh section is exposed for the next operation.

Applications

• PCB solder correction and rework.
• Removing solder bridges between SMD component pins.
• Cleaning excessive solder from through-hole components.
• Removing old solder before component replacement.
• Electronic device repair and maintenance.
• Mobile phone, computer, and industrial PCB repair.
• Prototype PCB assembly and modification.
• Educational electronics laboratories and training projects.

Specifications